TF228-M305-D-885
产品描述：
对环境污染的控制已成为经济发展中的首要义题，锡铅焊料是一种高度有毒的金属合金，它作为组装辅料被广泛用于现代电子组装工业。随着欧美RoHS指令的实施，电子产品制造商已经趋向于焊料的无铅化。
The control of environmental pollution has been considered as top priorities in economy development.Tin-lead solder is a highly poisomous metal alloy to used widely in modern modern assemble industry as assemable material .As EU RoHS directive adaptep and the electronic manufactuer has move to ward to lead-free process.
 
由同方公司研发的TF228系列焊锡膏为客户提供优良的可焊性与印刷型。TF228系列焊锡膏解决了无铅焊料在应用中出现的各种问题，如：储存于 运输稳定性，润湿性差以及由高温焊料导致的锡膏不耐热性。
TF228 series solder paste was developed by TongFang company,which provide excellent and printbility to meet customer’s needs.The TF228 series solves various prob lems as the implementation of lead-free solder.suceh asstorage stability,delivery stality,poorsolder wettability,and poor solder paste heat resistance caused by the high temperature solder.
 
产品特性：
此系列锡膏是零卤产品，残留物无色透明，优点黏度低，手动印刷不费力，活性适中，空洞低。主要应用于中高端产品，如电脑主板，电视，DVB
 
产品规格：Solder Specfications
焊接合金之成分Composition of solder alloy